| 摘要 |
PURPOSE:To quickly join a film carrier to a liquid crystal panel so as to suppress the diffusion of Sn in solder and to improve the reliability of the panel by heating the liquid crystal panel prior to injection of a liquid crystal to 60-180 deg.C soldering a film carrier thereto and sealing the liquid crystal therein after air cooling. CONSTITUTION:An outer lead 2 held to a polyimide film 3 is subjected to solder plating. Ni for soldering is preliminarily patterned onto a glass substrate 11. Such substrate and another sheet of glass substrate 2 are stuck to each other by an epoxy resin sealing 15 and is cut to form the liquid crystal panel prior to the injection of the liquid crystal. The panel formed in such a manner is set on a stage 8 heated to 150 deg.C. After the heating up of the substrate 11 to 150 deg.C is confirmed, a bonding tool 7 heated to 230 deg.C is pressed thereto for about 3sec under 60g/lead pressure to join the outer lead 2 and metallized layer 13. Gaseous N2 is blown for 5sec to the joined part at the same instant when the bonding tool is detached; thereafter, the cell is air-cooled down to an ordinary temp. and the liquid crystal is sealed therein.
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