| 摘要 |
PURPOSE:To smooth the flow of an exhaust flow in a partition wall, and to protect the back of a substrate by boring an exhaust nozzle for air to the side surface of a spin chuck in an applicator applying a photo-resist to the substrate, turning the spin chuck, to which the semiconductor substrate is sucked. CONSTITUTION:Exhaust nozzles 3 for air are bored to the side surface of a spin chuck 2 in a line manner. Since air is ejected from the exhaust nozzles 3 in the side surface of the spin chuck 2 when a photo resist is spin-coated to a semiconductor substrate 1, a strong air flow is generated up to an exhaust port 5 from the exhaust nozzle sections, thus smoothing an exhaust flow. Consequently, the scattered photo resist is discharged sufficiently, and the quantity of the photo-resist adhering on the wall surface of a partition wall 4 is reduced, thus preventing the spring-back of the photo-resist. An air flow layer is formed on the back of the substrate, and functions as protection to the back of the substrate when the photo-resist is sprung back, thus obviating re-adhesion thereof.
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