| 摘要 |
PURPOSE:To allow a sputtered target material to come only in approximately the same area as the area of an Si wafer by covering a sputtering source and a shutter movable range of a sputtering device with a shielding material and providing an aperture of approximately the same area as the area of the Si wafer to the shielding material. CONSTITUTION:The sputtering source 2 is provided on the vacuum side on the wall surface of a vacuum vessel 1 and the Si wafer 3 is attached to face the same by a holder 4. The sputtering source shield 8 formed by having the aperture of approximately the same area as the area of the sputtering source 2 and movably attached with a shutter plate 6 to a cylinder having the aperture of approximately the same area as the area of the Si wafer 3 is fixed by screws 11 to the shield 7. The shutter 6 is housed into the box part of the shield 8 when the shutter 6 is opened at the time of forming a thin film on the Si wafer 3 by sputtering. The target material sputtered from the sputtering sources passes the aperture of the area approximately the same area of the Si wafer 3 so that only the target material of the area approximately the same as the area of the Si wafer splashes onto the Si wafer. The incoming of a large amt. of the target material to the part except the Si wafer surface is thus prevented.
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