| 摘要 |
PURPOSE:To prevent the deposition of harmful metal in the gaps in a fine metallic pattern when the pattern is formed on the surface of a substrate by electroless plating, by immersing the substrate in an electroless plating bath and stirring the bath after the lapse of a specified time. CONSTITUTION:A pattern such as a wiring circuit is formed on the surface of a semiconductor substrate or an insulating substrate 17 with Pd as an activating catalyst. The substrate 17 is immersed in an electroless Ni alloy plating bath 13 contg. hypophosphorous acid as a reducing agent, e.g., an Ni-P alloy plating bath. The substrate 17 is reducing agent, e.g., an Ni-P alloy plating bath. The substrate 17 is allowed to stand for 1-60sec in the bath 13 and the bath 13 is stirred by driving a stirrer consisting of a motor 21 and a stirring blade 23. Thus, a fine Ni-P alloy pattern having very high accuracy can be formed by electroless plating without depositing unnecessary Ni-P alloy in the very narrow gaps in the pattern. |
