| 发明名称 |
METAL COMPOSITE LAMINATED BOARD |
| 摘要 |
A substrate for a printed circuit board, comprising a metal core plate having apertures and an inorganic fiber cloth impregnated with a heat resistant thermoplastic resin, coated thereon, wherein said apertures are filled with a mixture of said resin and an inorganic filler. |
| 申请公布号 |
JPS62251136(A) |
申请公布日期 |
1987.10.31 |
| 申请号 |
JP19860096114 |
申请日期 |
1986.04.25 |
| 申请人 |
MITSUBISHI PLASTICS IND LTD |
发明人 |
NAGAMATSU KEIJI;IWASAKI KANAME |
| 分类号 |
B32B15/08;B32B17/04;H05K1/03;H05K1/05;H05K3/44;H05K3/46;H05K9/00 |
主分类号 |
B32B15/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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