发明名称 THIN-FILM THERMAL HEAD
摘要 PURPOSE:To make it possible to sufficiently cope with high-speed recording and high printing quality problems and to reduce the size of the title head and enhance reliability of the head, by providing at least one thermal resistance layer on at least a part of a silicon substrate, providing a thin film of polycrystalline silicon thereon, and providing heat generating resistors and driving circuit parts by utilizing the thin film. CONSTITUTION:An insulating substrate 1 is formed from silicon having a high thermal conductivity, and a thermal resistance layer 2 is provided thereon in a thickness of, for example, 1-500mum so as to provide thermal conductivity in a preferable range. With this construction, the heat generated at heat generating resistors can be appropriately controlled, the heat is prevented from being accumulated in excess in the layer 2 or in the substrate 1, and such a control as to prevent trailing of recorded images or nonuniformity of density from being generated can be performed. Accordingly, printing quality is enhanced, and it is possible to cope with high-speed recording problems. In addition, since driving circuit parts 3A and the heat generating resistors 3B are provided on the thermal resistance layer 2 by utilizing a thin film 3 of polycrystalline silicon, projections of the driving circuit parts 3A can be set to be minute, and the need for wire bonding or other similar steps can be eliminated, resulting in higher reliability.
申请公布号 JPS62248663(A) 申请公布日期 1987.10.29
申请号 JP19860092538 申请日期 1986.04.22
申请人 SONY CORP 发明人 YAGINO MASANORI;HAYASHI HISAO
分类号 B41J2/335 主分类号 B41J2/335
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