| 摘要 |
PURPOSE:To reduce the workhours of the work for executing electrical contacts and fixing work largely by forming a bump to one of a conductive wiring and a bonding pad in a chip, directly executing the electrical contacts and fixing the chip by adhesives. CONSTITUTION:Bumps 16 are shaped to at least one of conductive wirings 14 formed onto a substrate and bonding pads 13 in a chip, and electrically brought into contact directly, and the chip 12 is fastened by adhesives 15. Accordingly, workhours can be shortened because the fixation of the chip 12 and the work of wire bonding are conducted simultaneously and wires need not be bonded one by one while cost can be reduced because the wires are unnecessitated.
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