| 摘要 |
A semiconductor device in which a lead is connected to a bonding pad of a semiconductor pellet by a copper wire, and in which the copper wire is ball-bonded to the bonding pad. The copper wire is composed of copper having a purity of higher than 99.999%, and the ball portion has a microvickers hardness of 35 to 65, to reduce the likelihood of bonding damage to the semiconductor pellet and its surface layers. |
