发明名称 THERMOPLASTIC MOLDING MATERIAL
摘要 Thermoplastic moulding compositions containing A) at least 5% by weight of a polyphenylene ether, B) at least 5% by weight of a polyamide, and containing C) at least 0.1% by weight of a copolymer built up from C1) at least 80% by weight of styrene and/or substituted styrenes of the formula I <IMAGE> where R and R<1> are an alkyl radical having 1 to 8 carbon atoms, a hydrogen atom and/or a halogen atom, and n is 0, 1, 2 or 3, C2) at least 0.5% by weight of an epoxide group-containing, polymerisable monomer, and/or C3) at least 0.05% by weight of a halobenzyl group-containing, polymerisable monomer containing the structural unit (II) <IMAGE> where X is a halogen atom, and R<2> and R<3> are each an alkyl radical having 1 to 8 carbon atoms or a hydrogen atom, and n is 1, 2 or 3, and C4) from 0 to 10% by weight of acrylonitrile, methacrylonitrile and/or further nonionogenic comonomers, are distinguished by particularly good impact strength.
申请公布号 JPS62246957(A) 申请公布日期 1987.10.28
申请号 JP19870005187 申请日期 1987.01.14
申请人 BASF AG 发明人 KURISUTOFU TAUBITSUTSU;EERUHARUTO ZAIRAA;YURUGEN HAMUBUREHITO;KONRAATO MITOURA;KURAUSU BEERUKE
分类号 C08L25/02;C08L53/02;C08L67/00;C08L71/00;C08L71/12;C08L77/00 主分类号 C08L25/02
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