INTEGRATED CIRCUIT PACKAGE

摘要

The present invention relates to an integrated circuit package of the type which comprises a lead frame (11) formed with a plurality of connecting leads (12) and two substantially identical integrated circuit chips (13, 15) mounted on the lead frame. An integrated circuit package in accordance with the invention is characterised in that one integrated circuit chip (13) is mounted on one side of the frame, the other integrated circuit chip (15) is mounted on the other side of the frame, and each pair of corresponding terminals (14, 16) of the two integrated circuit chips are connected to the same connecting lead (12) of the frame.