发明名称 PACKING STRUCTURE FOR CHIP RESISTOR
摘要 PURPOSE:To improve the impedance characteristics of a chip resistor by extending a microstrip line up to a point under the part of the chip resistor except its electrode and at the same time forming the resistance film of the chip resistor against the microstrip line. CONSTITUTION:A chip resistor 3 has an electrode 31 connected to a microstrip line 8 and the other electrode connected to a pattern 2 of a microstrip which is grounded by an earth metallic piece 4 respectively. The line 8 is extended up to a point under the part of the resistor 3 excep the electrode 31. At the same time, a resistance film 33 is formed opposite to the line 8. Thus the electrostatic capacity is produced between the film 33 and the line 8 and therefore the parasitic inductance of the piece 4 or the resistor 3. As a result, the impedance characteristics is improved with the resistor 3.
申请公布号 JPS62247603(A) 申请公布日期 1987.10.28
申请号 JP19860086301 申请日期 1986.04.15
申请人 FUJITSU LTD 发明人 SUGAWARA HIDEO
分类号 H01P1/22;H01P1/26 主分类号 H01P1/22
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