发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To always bestow an optimum bonding load under any bonding condition, and to enhance bonding precision by a method wherein a load supply means is furnished with a solenoid coil and an iron core arranged in the solenoid coil, and a current generated corresponding to a point to be bonded is supplied to the solenoid coil. CONSTITUTION:A load supply means to make bonding load to be changed corresponding to the bonding condition, and to attain a function to always perform an optimum bonding work is constructed of a solenoid coil 17, an iron core 16 and a wire 10 connected to the iron core 16 thereof. At this case, the purpose can be attained only by supplying output of a current amplifier 14 to the solenoid coil 17. Moreover, it is favorable also to fit up an usual tensile spring as it is, and to make load thereof and the wire 10 for tension are made to coexist together. Because bonding load can be controlld according to control of the current of the solenoid coil 17 like this, the bonding device can be formed in a comparatively simple construction.
申请公布号 JPS62247538(A) 申请公布日期 1987.10.28
申请号 JP19870001601 申请日期 1987.01.09
申请人 HITACHI LTD 发明人 TANIGUCHI YUZO
分类号 H01L21/60 主分类号 H01L21/60
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