Improved wetting of low melting temperature solders by surface active additions.

摘要

A lead based alloy is modified by adding thereto a surfactant consisting of about 0.0l to 0.5 weight percent tellurium, about 0.0l to 0.5 weight percent selenium, about 0.0l to 0.5 weight percent selenium plus about 0.l-0.5 weight percent antimony, and mixtures thereof. The alloy is rapidly solidified by forming a melt thereof containing the surfactant addition and quenching the melt on a moving chill surface at a quenching rate of at lease about l03 DEG C/sec. Addition of the surfactant lowers melt surface tension and thereby promotes improved wetting.