发明名称 PIN GRID ARRAY PACKAGE SUBSTRATE
摘要 PURPOSE:To enable attaching a conductor pin to a base substrate simply, rapidly and strongly by fixing the conductor pin by an extremely simple method of integrally forming when the base substrate made of an organic resin such as an epoxy resin is formed. CONSTITUTION:The middle part of a conductor pin 2 has a greater diameter region 8, the greater diameter region 8 of the conductor pin 2 is buried in an organic resin substrate 1 and the top 9 of each conductor pin 2 is projected from the surface of the organic resin substrate 1. Since the conductor pin 2 is fixed in this way by integrally forming with the formation of the organic resin substrate 1, the conductor pin 2 is attached easily and rapidly and the fixing of the conductor pin 2 to the organic resin substrate 1 is strong due to the greater diameter region 8 formed in the middle part of the conductor pin 2.
申请公布号 JPS62247554(A) 申请公布日期 1987.10.28
申请号 JP19860090999 申请日期 1986.04.18
申请人 IBIDEN CO LTD 发明人 IZUMI KOICHI;TAKENAKA HIRONORI
分类号 H01L23/50;H01L23/12;H01L23/498 主分类号 H01L23/50
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