| 摘要 |
PURPOSE:To obtain a sealing resin composition excellent in moisture resistance, soldering heat resistance, etc., by using an epoxy resin containing a dicyclopentadiene skeletal structure, a novolak phenolic resin and a silica powder in a specified weight ratio. CONSTITUTION:The purpose sealing resin composition is prepared by using an epoxy resin (A) having a dicyclopentadiene skeletal structure in the molecule (e.g., a compound of the formula), a novolak phenolic resin (B) and 68-85wt%, based on the resin composition, silica powder (C) as essential components. This sealing resin composition has good adhesion and low susceptivity to moisture absorption, can show excellent moisture resistance even after immersion in a soldering bath and can decrease occurrence of disconnection due to corrosion of an electrode or a leakage current so that it can be suitably used for, for example, sealing, coating or insulating electronic and electric components.
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