| 摘要 |
PURPOSE:To obtain the titled resin composition improved in cracking resistance and moisture resistance, by adding a conjugated diene rubber and/or an acrylic rubber each having specified properties as a modifier to a resin composition comprising an epoxy resin, a curing agent, a filler, etc. CONSTITUTION:The purpose epoxy resin composition for semiconductor sealing is prepared by mixing an epoxy resin (A) with a curing agent (B) (e.g., maleic anhydride), filler (C) (e.g., quartz glass powder) and a modifier (D) comprising a conjugated diene rubber and/or an acrylic rubber each having a metal content <=100ppm and an ion content <=100ppm as determined by ion-chromatography. Examples of component D include butadiene/acrylonitrile copolymer rubber and butyl acrylate/ethoxyethyl acrylate/vinyl chloroacetate/acrylonitrile copolymer rubber.
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