| 摘要 |
<p>In an injection laser package having a housing (30) an optical fibre pigtail (36) extends onto a sub-mount (2A) of a mount (1), the sub-mount (2A) being formed of a plurality of thick film layers which incorporate a resistance heating element (5) and etched conductors (4A, 4B) insulated (6) from a narrow solder pad (7). With the end portion (36A) of the fibre in alignment with the injection laser chip (33) a current is applied to the conductors (4A, 4B) to heat the sub-mount and melt the solder pad (7) to thereby hold the fibre exactly in alignment with the chip (33). The portion (36B) of the fibre extending between the sub-mount and the inner end of the entrance support tube (35) remains unsupported and thereby flexible so that external stresses on the package housing and, particularly, the tube (35) do not transfer any strain to the end portion (36A) of the fibre so that alignment with the injection laser chip (33) is maintained</p> |
