Apparatus for testing semiconductor devices.

摘要

An apparatus (201) for testing a semiconductor device including a dielectric package (202) and a lead (202a) with respect to withstand voltage thereof against electrostatic charges existing on the dielectric package (202). The apparatus comprises charging means having a metal plate (203) connected to an output terminal of a DC power source (206) for charging the dielectric package by bringing the metal plate (203) into contact with the surface of the package (202) when voltage is supplied from the DC power source (206) thereto, first discharge means having a metal bar (204) connected to ground potential via load impedance for discharging charges on the package (202) by selectively bringing the metal bar (204) into contact with the lead in (202a) said successive charging of the package (202), and second discharge means having a terminal (205a) connected to the ground potential via a resistor (211) for discharging charges remaining in a circuit of the semiconductor device by bringing the terminal into contact with the lead (202a) after stopping the supply of the voltage in succession to the discharging by the first discharge means.