RESIN SEAL TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE:To prevent the lowering of moisture vapor resistance due to the peeling of the interface between a header in the vicinity of a chip and a resin package section and the crack of the chip by forming a stress concentrating section to the header between a fitting hole and the chip or a resin sealing body. CONSTITUTION:A section with a fitting hole 5 of a resin package 2 forms a bolt fitting surface 11. A groove 12 is formed along the stepped section of the package 2. The groove 12 is shaped so as to cross with one part of the hole 5. The groove 12 fills the role of an absorption by stress concentration in the groove 12 section of stress by the clamping of a bolt 7 inserted into the hole 5 and the prevention of an effect on a main package section 14 covering a chip 13 when the resin package is superposed on a mounting plate 3 through a mica board 4 and fixed by the clamping of the bolt 7 and a nut 8 engaging with the bolt. A groove 15 is also formed to a header 1 constituting a lower surface section, the deformation of the header 1 by the clamping of the bolt 7 is absorbed by the groove 15 section, and an effect on a loading section 16 fixing the chip 13 is prevented.