发明名称 Reticle assembly, system, and method for using the same
摘要 A reticle assembly, exposure system, and method for exposing each of a plurality of levels of a single die or device dies of a semiconductor wafer to a pattern of radiation on a site-by-site exposure basis are disclosed. Radiation patterning means between a source of radiation and the semiconductor wafer pattern the radiation onto the semiconductor wafer and a stepping means incrementally moves the semiconductor wafer relative to the patterning means for exposing the device dies, one at a time, in succession. The patterning means includes a reticle assembly having a plurality of reticles arranged in a coplanar array with each reticle having a respective different die exposure pattern.
申请公布号 US4702592(A) 申请公布日期 1987.10.27
申请号 US19860879890 申请日期 1986.06.30
申请人 ITT CORPORATION 发明人 GEIGER, DAVID J.;LEE, SUNNY;BUSCH, ERIC
分类号 G03F1/14;G03F7/20;(IPC1-7):G03B27/42 主分类号 G03F1/14
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