发明名称 |
Reticle assembly, system, and method for using the same |
摘要 |
A reticle assembly, exposure system, and method for exposing each of a plurality of levels of a single die or device dies of a semiconductor wafer to a pattern of radiation on a site-by-site exposure basis are disclosed. Radiation patterning means between a source of radiation and the semiconductor wafer pattern the radiation onto the semiconductor wafer and a stepping means incrementally moves the semiconductor wafer relative to the patterning means for exposing the device dies, one at a time, in succession. The patterning means includes a reticle assembly having a plurality of reticles arranged in a coplanar array with each reticle having a respective different die exposure pattern.
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申请公布号 |
US4702592(A) |
申请公布日期 |
1987.10.27 |
申请号 |
US19860879890 |
申请日期 |
1986.06.30 |
申请人 |
ITT CORPORATION |
发明人 |
GEIGER, DAVID J.;LEE, SUNNY;BUSCH, ERIC |
分类号 |
G03F1/14;G03F7/20;(IPC1-7):G03B27/42 |
主分类号 |
G03F1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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