Breadboard panel construction for electronic circuitry

摘要

This invention relates generally to an electronic circuit breadboard assembly having a particular novel layered construction. In place of a conventional solid chipboard laminated construction, an undulated midstratum layer is utilized in such manner that air cells or pockets are formed within the structure. An overlayer and an underlayer are adhesively applied to the undulated midstratum layer. The invention results in a breadboard assembly which may be much more economically manufactured while yielding superior end product strength and durability. The invention has widespread utility in the electronics assembly field as a superior substitute for the currently used solid laminated chipboard design.