发明名称 FREQUENCY ADJUSTMENT METHOD FOR SURFACE WAVE DEVICE
摘要 PURPOSE:To attain the resistance to organic solvent and to attain frequency adjustment by using a specific resin and varying the formed film thickness so as to form simply the thin film thereby reducing the propagation loss and conversion loss by the thin film forming. CONSTITUTION:A resin selected among resins comprising polybenzoimidazol group resin, polybenzoxazinone rein, polyquinaizorinedione resin, polyamide resin, polysulfonic resin, poly P xylene resin, fluororesine, polyester resin, vinyl resin and phenolic resin is used as the thin film and the frequency is adjusted by chaning the film thickness formed. In applying a specific diluting agent to a specific resin to adjust the viscosity, the thin film is formed simply by using, e.g., spray. In using a proper mask, the thin film is easily formed selectively only at a desired part requiring the frequency adjustment for the surface wave device.
申请公布号 JPS62245712(A) 申请公布日期 1987.10.27
申请号 JP19860089077 申请日期 1986.04.16
申请人 MURATA MFG CO LTD 发明人 KADOTA MICHIO;IKEDA TOSHIAKI;KONDOU CHIKAFUMI
分类号 H03H3/10 主分类号 H03H3/10
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