| 摘要 |
PURPOSE:To supply an optimum amt. of metallic ions into a plating soln. by measuring the liq. level in a soln. tank and the weight of the liq. to calculate the amt. of the residual metal in the tank, and replenishing an appropriate amt. of metallic ions based on the amt. CONSTITUTION:A plating soln. is introduced into the soln. tank 1 from a plating soln. supply port 3, the sludge is separated by a filter 6, and the soln. is discharged from a discharge port 7 to keep the purity. The plating soln. is then introduced through a chute 2 and brought into contact with the metallic particles 10 which are uniformly dispersed in the soln. tank 1 by a conical baffle 5. Consequently, the plating soln. supplied with a requisite amt. of metallic ions is supplied to an electroplating cell from a plating soln. return port 4. The total volume V and the total weight W of the metallic ions 10 plus the plating soln. in the soln. tank 1 are obtained by a level gage 8 and a weighing device 9 in the metallic ion supply device of the above-mentioned structure. The amt. of residual metal 10 is calculated from the equation W=rho1V1+rho2(V-V1) (where rho1 and rho2 are the sp.gr. of the metal and the plating soln., and V1 is the volume of the metal), and an appropriate amt. of metal is replenished.
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