摘要 |
PURPOSE:The titled composition, consisting of a heat bonding polyamide based resin, antiblocking polyamide based resin, plasticizer, wax, lubricant and inorganic antiblocking agent and suitable for shrinkable labels. CONSTITUTION:An adhesive composition consisting of (A) preferably 15-25pts. wt. heat bonding polyamide based resin, preferably having 100-120 deg.C softening point and higher molecular weight than that of a component (B), (B) preferably 10-15pts.wt. antiblocking polyamide based resin, preferably 10-30P melt viscosity (160 deg.C), (C) preferably 4-7pts.wt. plasticizer, preferably N-ethyl-o- toluenesulfonamide, etc., (D) preferably 2-4pts.wt. wax, preferably microcrystalline wax having 40-100 deg.C softening point, (E) preferably 0.5-1pts.wt. lubricant and (F) preferably 1-2pts.wt. inorganic antiblocking agent.
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