发明名称 ROLLED COPPER FOIL FOR PRINTED CIRCUIT BOARD
摘要 PURPOSE:To manufacture a rolled copper foil of oxygen-free copper reduced in softening temp., by incorporating specific percentage of one or more kinds among Ca, Zr, and misch metal to copper and by regulating oxygen content to a specific amount or below. CONSTITUTION:The rolled copper foil which consists of 10-300ppm, in total, of 1 or >=2 kinds among Ca, Zr, and misch metal and the balance copper with inevitable impurities and in which oxygen content is regulated to <=10ppm is manufactured. This rolled copper foil has low softening temp., so that it can be used for printed circuit boards.
申请公布号 JPS62243727(A) 申请公布日期 1987.10.24
申请号 JP19860087726 申请日期 1986.04.16
申请人 HITACHI CABLE LTD 发明人 ABE HAJIME;KURIYAGAWA TOMIYASU;HAGIWARA NOBORU
分类号 C22C9/00;H05K1/09 主分类号 C22C9/00
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