| 摘要 |
PURPOSE:To selectively form electroplated layers having the shapes of apertures in a plating preventing film stuck to the surfaces of electric conductors on the surfaces of the conductors by forming an electrically conductive coating layer from the peripheries of the apertures and supplying electric current through the coating layer. CONSTITUTION:Electric conductor layers 2 are formed on an insulating substrate 1 in a prescribed pattern and a plating preventing film 3 having apertures 5, 7 is stuck to the surfaces of the layers 2 with an adhesive 4. The film 3 is preferably made of polyimide or polyester. Epoxy resin blended with an aromatic amine curing agent and cured to B stage is suitable for use as the adhesive 4. An electrically conductive coating layer 6 having an electrode pattern for electric conduction is then formed on the film 3 from the peripheries of the apertures 5 so that the layer 6 reaches the surfaces of the layers 2. Electric current is supplied through the coating layer 6 to carry out electroplating with a plating soln. such as a silver cyanide soln. Finally, the film 3 is stripped. Thus, electroplated layers 8, 9 of silver or the like having the shapes of the apertures 5, 7 are easily formed on the islandlike electric conductor layers 2. |
