发明名称 PREPARATION OF THERMAL HEAD
摘要 PURPOSE:To obtain a thermal head used in the output part of a facsimile or a printer, by electrically connecting a first conductor pattern formed on a substrate to the second conductor pattern capable of being led to the outside of the substrate by a short pattern being the same resistor film as a heat generator and formed simultaneously with the heat generator and applying electroplating treatment to the surface of the first conductor pattern. CONSTITUTION:A resistor film 6 having to become a heat generator is formed to the entire surface of a glazed substrate 5, and a heat generator 7 and a short pattern 8 are formed simultaneously. Next, a conductor film 9, for example, consisting of lower layer chromium and upper layer copper each having a thickness of several hundred nm is formed to the entire surface of the substrate 5 and a current supply conductor pattern 10 to the heat generator, a common pattern 11, a data transmitting pattern 12 and signal wires 13 for guiding the timing signal of the power source wiring or switching of drive IC from the outside are formed. Thereafter, a protective layer is formed to the heat generator part and a resist is further formed to a plating unnecessary part to cover the same, and common A and common B are connected to a plating power source, and nickel plating and gold plating are continuously formed to the exposed part of each conductor pattern at every 1mum thickness to cut off the common B becoming unnecessary.
申请公布号 JPS62244662(A) 申请公布日期 1987.10.26
申请号 JP19860087647 申请日期 1986.04.16
申请人 SEIKO INSTR & ELECTRONICS LTD 发明人 SAIDA KATSUAKI;MOTOYOSHI YUKIO
分类号 B41J2/335;B41J2/345 主分类号 B41J2/335
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