| 摘要 |
PURPOSE:To reduce the variation in a circuit resistance value of a hybrid integrated circuit substrate by providing a compensating insulator on the substrate to be formed with a resistor adjacent to an insulator pattern to form the resistor of substantially the same thickness as the resistor attached to other flat surface without influence of the height of the pattern. CONSTITUTION:A compensating insulator 7 is formed substantially in the same thickness simultaneously with insulators 4a, 4b adjacent to a resistor 1 on a substrate 6 to be formed with the resistor 1, the distance (m) of the flat surface of the insulator 7 formed with the resistor 1 and a printing screen surface is formed substantially the same as the thickness of conductors 5a, 5b, and the resistor 1 is formed on the insulator 7. Accordingly, substantially the same thickness as the resistor formed on the flat surface of the substrate 6 not adjacent to the insulator is obtained.
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