| 摘要 |
<p>PURPOSE:To automate the mounting work of a flat package (FP) on a printed substrate by supporting an external force applied to the FP when mounting the FP by a guide stopper to prevent lead pins from damaging or deforming. CONSTITUTION:A guide stopper 3 is increased, for example, in size and shape as compared with a lead pin 2 to support an external force, when applied to the upper surface of an FP body 1, by the stopper 3 to prevent the pin 2 from damaging or deforming, and the end projection of the stopper 3 is inserted into a hole 5 of a printed substrate 4 to mount the body 1 at a predetermined position of the substrate 4.</p> |
