| 摘要 |
PURPOSE:To erase resins, and to improve reliability by potting an ultraviolet-ray transmitting type resin and further potting an ultraviolet-ray non-transmitting type resin onto the ultraviolet-ray transmitting type resin when an EPROM element is molded with the resins. CONSTITUTION:An EPROM element 5 is die-bonded at a predetermined position on a conductor layer 2, and electrodes 6 on the element 5 and the conductor layer 2 are connected by wires 7 for connectors through a wire bonding system. The electrodes 6 and the conductor layer 2 are wire-bonded, a potting frame 8 consisting of the quality of a material such as glass epoxy is fitted to a glass epoxy film substrate 1 by epoxy adhesives and the like in order to stop a flow on resin potting, and an ultraviolet-ray transmitting type resin 9 is potted first, and cured, thus molding the EPROM element 5. An overall byte writing test is conducted at the stage, and the possibility of writing is checked. The assembly of the element is aged by being positioned at a high temperature, and the capacity of data-hold is checked. The capacity of data-hold is checked, and data are erased by ultraviolet irradiation. |
