| 摘要 |
PURPOSE:To fix several pins securely to a resin substrate with facility and provide such pins with enhanced pull-withstanding capability by a method wherein ends of the pins are insert-molded for the pins to be fixed secure in the substrate and allowed to protrude from the resin substrate simultaneously with the formation of said resin substrate whereon an electronic part chip is to be installed. CONSTITUTION:A resin substrate 1 to be mounted with a semiconductor chip 2 is formed by molding and, simultaneously, several pins 3 with their ends insert-molded in the substrate 1 are allowed to protrude from the substrate 1. A flexible wiring circuit board 4 is fixed secure to the substrate 1, the ends of the pins 3 are connected to the flexible wiring circuit board 4, and the semiconductor chip 2 to be installed on the substrate 1 is electrically connected to the pins 3 by a conducting circuit 5 provided in the flexible wiring circuit board 4. The insert-molding of the pins 3 in the substrate 1 allows the pins 3 fixed secure with facility, the molding of the pins 3 may be accomplished simultaneously with the molding of the substrate 1 if the substrate 1 is provided with a recess 10 for the installation of the semiconductor chip 2. Circuiting may be completed without an etching process for the substrate 1 that otherwise may be required for the installation of the flexible wiring circuit board 4 to the substrate 1. |
