| 发明名称 |
PROCESS FOR FORMING A PROTECTIVE COATING ON INTEGRATED CIRCUIT DEVICES |
| 摘要 |
A protective coating is formed on an integrated circuit device by coating the device with a solution of acetylene terminated, branched polyphenylene prepolymer material and heating the material to form a thermoset crosslinked polymer layer. Selectively patterned portions may be provided when, after the coating step and prior to the heating step, the steps of imagewise exposure to radiation and rinsing with an organic solvent are carried out. |
| 申请公布号 |
DE3277344(D1) |
申请公布日期 |
1987.10.22 |
| 申请号 |
DE19823277344 |
申请日期 |
1982.05.28 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BAISE, ARNOLD IVAN;CZORNYJ, GEORGE;WU, ANTHONY WAI |
| 分类号 |
H01L23/29;G03F7/025;G03F7/09;G03F7/11;H01L21/027;H01L21/312;H01L23/31;(IPC1-7):H01L21/56;G03C1/68 |
主分类号 |
H01L23/29 |
| 代理机构 |
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代理人 |
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