| 摘要 |
PURPOSE:To manufacture a ceramic sealed semiconductor device with high airtightness and excellent reliability by a method wherein the surface of an Al layer sticked to a semiconductor pellet or wafer is processed with oxygen plasma to be formed into an alumina film which is used to fix the semiconductor or pellet to a protective case. CONSTITUTION:An Al layer 2 is formed on the back surface of a semiconductor pellet 1 with a circuit pattern formed of a semiconductor element on the surface thereof and then the surface of Al layer 2 is plasma-processed at low temperature to form an alumina film 5. On the other hand, a low melting point glass 4 is sticked on the pellet fixing part of a ceramic case 3. In such a constitution, the Al layer 2 with the aluminium film 5 in even thickness and the low melting point glass 4 are reacted to fix the semiconductor pellet 1 to the ceramic case 3. |
