MULTILAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS

摘要

Multilayer printed circuit boards are designed and produced using a selective wiring technique which segregates short, medium length and long lines. By placing short medium length and long lines on different layers, line specifications can be relaxed for the layers with shorter lines. This relaxation of specifications allows for the effective use of subtractive, additive and encapsulated wire manufacturing techniques in the production of complex multilayer printed circuit boards. Each layer of segregated line lengths is fabricated in accordance with the appropriate technique for a given line length to obtain a multilayer printed circuit board optimized for cost and/or performance and reliability.