| 摘要 |
PURPOSE:To form a plastic-package and a transparent plastic window through injection molding, and to reduce cost by sealing a solid-state image sensor into the plastic-package by the transparent plastic window by ultrasonic waves. CONSTITUTION:A plastic-package 2 is incorporated into a frame 1, a light- receiving chip 3 is assembled together with leads 6 to the frame 2, and a trans parent plastic window 4 is sealed on an ultrasonic joint surface 5 by ultrasonic waves as a light-receiving window for the plastic-package 2. Accordingly, the plastic-package and the transparent plastic window can be formed through injection molding, and cost can be reduced extremely while ultrasonic sealing by the plastic package of the transparent plastic window can be conducted at room temperature, thus also preventing deterioration by the sealing tempera ture of a color filter for a color image sensor. |
