| 摘要 |
PURPOSE:To reduce the generation of defective products by providing a photosensor at the tip of a drip-feed nozzle, detecting the redripping of a liq. photoresist by the sensor, and stopping the device. CONSTITUTION:A liq. photoresist is coated on a wafer by the coating device. In the device, the photosensor 2 is mounted on the tip part of the drip-feed nozzle 1 fixed above a vacuum chuck 4. The redripping of the liq. photoresist on the semiconductor wafer fixed on the vacuum chuck is detected by the photosensor 2, the result is reported to a CPU 3, the movement of the device is stopped by the CPU 3, and an operator is informed of the redripping of the liq. photoresist. The generation of defective products due to the redripping of the liq. photoresist is reduced in this way.
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