| 摘要 |
PURPOSE:To prevent the corrosion of a lead for a molded form, in which a semiconductor element is sealed, and to eliminate the lowering of strength by connecting a substance having corrosion potential lower than that of a lead frame material for the molded form, in which the semiconductor element is sealed, to the lead for the molded form. CONSTITUTION:Iron or a nickel alloy is used as leads 2 for a molded form 1 in which a semiconductor is sealed, and magnesium is employed as sacrificial anodes 3 consisting of a substance having corrosion potential lower than that of the material of the leads 2. Since the leads and the sacrificial anodes are connected by conductors 4, potential difference is generated among the leads 2 and the sacrificial anodes 3. When the leads 2 are brought to a corrosive state, protective currents are extracted continuous]y by utilizing potential difference between both the leads and the sacrificial anodes, thus preventing the corrosion of the leads. Accordingly, the lowering of the strength of the leads due to the corrosion of the leads can also be obviated. |
