| 摘要 |
PURPOSE:To manufacture a lead material capable of directly plating soft solder free from peeling even if temp. is elevated, by adding trace amounts of Ag, Mn, Ni, Sb, and Zn to a Cu-Sn alloy. CONSTITUTION:0.1-2.5% Sn by weight and 0.1-1.0% of one or more elements among Ag, Mn, Ni, Sb, and Zn are incorporated to Cu. This lead material is capable of directly plating soft solder and, even if a diffusion alloy layer with Sn is formed, soft solder hardly peels of from the interface. Consequently, even if this lead material is used under the condition of sharp temp. rise such as automobile engine room, it has no possibility of causing peeling of soft solder, so that reliability of products can be remarkably improved. |
