发明名称 |
FORMATION OF ETCHING MASK PATTERN |
摘要 |
PURPOSE:To simplify the forming stages and to improve the forming efficiency and accuracy by forming a layer or a material different from a material to be etched on the surface of the material and by selectively irradiating high energy beams on the layer so as to partially remove the layer. CONSTITUTION:A layer of a material different from a material 4 to be etched on a substrate 2 is formed on the surface of the material 4. High energy beams 8 are selectively irradiated on the layer and this layer is partially removed to form an etching mask 6' whose material is different from the material 4 to be etched.
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申请公布号 |
JPS62240776(A) |
申请公布日期 |
1987.10.21 |
申请号 |
JP19860082291 |
申请日期 |
1986.04.11 |
申请人 |
CANON INC |
发明人 |
TANAKA TOSHIMITSU;HAYASHI NOBUTOSHI;KONO MASAYUKI;CHIBA HIROSHI;SAWAYAMA IPPEI;KAMEI YOSHIHIDE |
分类号 |
C23F4/04 |
主分类号 |
C23F4/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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