发明名称 FORMATION OF ETCHING MASK PATTERN
摘要 PURPOSE:To simplify the forming stages and to improve the forming efficiency and accuracy by forming a layer or a material different from a material to be etched on the surface of the material and by selectively irradiating high energy beams on the layer so as to partially remove the layer. CONSTITUTION:A layer of a material different from a material 4 to be etched on a substrate 2 is formed on the surface of the material 4. High energy beams 8 are selectively irradiated on the layer and this layer is partially removed to form an etching mask 6' whose material is different from the material 4 to be etched.
申请公布号 JPS62240776(A) 申请公布日期 1987.10.21
申请号 JP19860082291 申请日期 1986.04.11
申请人 CANON INC 发明人 TANAKA TOSHIMITSU;HAYASHI NOBUTOSHI;KONO MASAYUKI;CHIBA HIROSHI;SAWAYAMA IPPEI;KAMEI YOSHIHIDE
分类号 C23F4/04 主分类号 C23F4/04
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