| 摘要 |
PURPOSE:To obtain a Cu alloy having superior precision workability and joining strength to solder by adding specified amounts of Cr, Sn, P and one or more among Zn, Cd, Co, Te, Y, a rare earth element, Nb, Ta and V to Cu. CONSTITUTION:A Cu alloy obtd. by adding, by weight, 0.2-1.0% Cr, 0.01-0.6% Sn, <=0.1% P and <=5% in total of one or more among 0.01-5% Zn, 0.01-0.2% Cd, 0.01-0.5% Co, 0.01-0.1% Te, 0.01-0.2% Y, 0.01-0.2% rare earth element, 0.01-0.2% Nb, 0.01-0.2% Ta and 0.01-0.2% V to Cu is hot worked at >=about 650 deg.C, cooled from about 650 deg.C to <=about 350 deg.C >=about 10 deg.C/sec cooling rate, cold rolled at >=about 30% draft and heat treated at about 350-600 deg.C. The resulting Cu alloy satisfies high performance and practical characteristics necessary for a Cu alloy for electronic apparatus typified by a lead frame for a semiconductor. |
