发明名称 PROCESS FOR PRETREATING POLYAMIDE SUBSTRATES FOR ELECTROLESS METALLISATION
摘要 <p>Process for pretreating polyamide substrates for electroless metallisation A mild activation process for the electroless metallisation of polyamide mouldings comprises treating the mouldings with a solution of a mixture of halides of elements of the 1st and 2nd main group of the Periodic Table (for example CaCl2) with salts of weak inorganic bases and strong inorganic acids (for example AlCl3) in a swelling agent or solvent for polyamides and with a metal-organic complex compound of elements of the 1st or 8th sub-group of the Periodic Table. The sequence is here immaterial. Le A 22 644</p>
申请公布号 CA1228267(A) 申请公布日期 1987.10.20
申请号 CA19840466912 申请日期 1984.11.02
申请人 BAYER AKTIENGESELLSCHAFT 发明人 SIRINYAN, KIRKOR;WOLF, GERHARD D.;MERTEN, RUDOLF;VON GIZYCKI, ULRICH
分类号 C08J7/12;C23C18/28;C23C18/30;H05K3/18;H05K3/38;(IPC1-7):C23C18/04 主分类号 C08J7/12
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