Method for manufacturing semiconductor power modules with an insulated contruction

摘要

A method for manufacturing insulated semiconductor power modules includes: presoldering a plurality of semiconductor sandwiches and a carrier unit including a metal base plate, ceramic insulating discs and connecting tabs with a high-melting solder in a first step; joining the semiconductor sandwiches and the carrier unit together with a low-melting solder in a second step; performing the first and second soldering steps without flux in a gas from the group consisting of hydrogen and forming gas; and preventing a mixture of the high-melting solder and the low-melting solder during the second step.