| 摘要 |
PURPOSE:To improve wire bonding characteristics by making the Barcol hardness 55 at the lowest at 25 deg.C on the outer surface of the closed hole of a ceramic substrate filled with an electric insulation material. CONSTITUTION:A ceramic wiring board which has a conductor circuit is formed by filling an electric insulation material in part of the plural number of holes provided in a ceramic substrate. The Barcol hardness on the outer surface of the closed hole is made 55 at the lowest at 25 deg.C. The electric resistance of the ceramic substrate is 10<3>OMEGA-cm or more. This improves wire bonding characteristics. |
