发明名称 THIN FILM FORMING DEVICE
摘要 PURPOSE:To form thin films with even thickness and even impurity concentration by a method wherein, within a diffusion furnace type low pressure thin film forming device, a reactive tube is three layer tube structured while doping gas is evenly led in through pores near wafers. CONSTITUTION:Within diffusion furnace type low pressure thin film forming device, a reaction tube is three layer tube structured. The three layer tube is composed of the first reaction tube 1 positioned on the outermost shell to maintain the pressure not exceeding the atmospheric pressure the second reaction tube 2 positioned on the inner part of the reaction tube 1 and the third reaction tube 3 to be a substantial reactive region forming thin films above wafers 5. Doping gas led in the space between the reaction tubes 2 and 3 is further led in the reaction tube 3 through the pores made in the reaction tube 3. Through these procedures, thin films with even thickness and even impurity concentration can be formed.
申请公布号 JPS62239537(A) 申请公布日期 1987.10.20
申请号 JP19860082034 申请日期 1986.04.11
申请人 HITACHI LTD 发明人 MINE TOSHIYUKI;IIJIMA SHINPEI
分类号 H01L21/3205;H01L21/31;H01L21/316 主分类号 H01L21/3205
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