发明名称 SOLDER RIBBON AND ITS PRODUCTION
摘要 PURPOSE:To obtain a solder ribbon which has an extremely smooth surface, has a well shaped edge part and is excellent in appearance having surface gloss by ejecting the melt of one - multi-elements solder consisting of Pb, Sn or In added with a small amt. of Ag onto the surface of a cooling roll under rotation and cooling quickly and solidifying the melt directly to a ribbon shape. CONSTITUTION:A molten metal consisting of the above-described one - multi- elements solder added with 0.1wt% Ag is prepd. The molten solder 3 added with Ag is ejected onto the surface of a cooling roll 1 under rotation in an arrow direction and is quickly cooled and solidified. The resulted solder ribbon 5 is stripped from the surface of the roll 1 by which the intended solder ribbon is obtd. It is necessary in this case to control the surface temp. of the roll 1 to <=100 deg.C. The control is accomplished by cooling the inside part of the roll 1 with water or ejecting a very low temperature gas (e.g.; dried air of a low temp.) to the surface of the roll 1.
申请公布号 JPS6021198(A) 申请公布日期 1985.02.02
申请号 JP19830128794 申请日期 1983.07.15
申请人 FURUKAWA DENKI KOGYO KK 发明人 KIKUCHI SUKEYUKI;SHIROYAMA KAISUKE;KOSUGI KEIZOU
分类号 B23K35/40;B23K35/02 主分类号 B23K35/40
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