| 摘要 |
PURPOSE:To make it possible to facilitate the control of thermal conductivity and strength and to perform bonding with good reproducibility, by using double coated tape for bonding a heat sink and a semiconductor device. CONSTITUTION:A heat sink 1 and a main body 2 of a semiconductor device are bonded with double coated tape 4. A metal thin film 5 having good thermal conductivity is provided at the central part of the double coated tape 4. A bonding agent 6 is applied on both sides of the film 5 to a uniform thickness. In attaching the heat sink 1 to the main body 2 of the semiconductor device, the double coated tape 4 is used, and the bonding agent 6 can be applied on the metal thin film 5 having the good thermal conductivity to the uniform thickness. Therefore, the thermal conductivity and the strength, which are contradicting characteristics, can be readily set at the optimum balanced conditions. Since metal such as, e.g., aluminum, is used as the metal thin film 5 having good thermal conductivity for a base material of the double coated tape 4, the strength and the thermal conductivity at this part pose no problem at all. |
