| 摘要 |
PURPOSE:To form a rugged metallic copper-plated layer on the inner wall surface by pouring a copper plating soln. added with an oxyethylene surfactant and a low-concn. chloride as the additive onto the inner wall surface of a heat- transfer pipe, and using an insoluble anode. CONSTITUTION:A radiating film 3 is pressed on the outer periphery of a heat- transfer pipe 10 and fixed. The masking member 17 for a cap 11 is then inserted into the opening part 18 of the heat-transfer pipe 10 and fixed, and a plating soln. 9 added with an oxyethylene surfactant and a low-concn. chloride as the additive in a plating bath 7 is circulated through the inside of the heat-transfer pipe 10 in combination with a circulating pump 12. The insoluble anode 15 is positively charged by a DC power source 14, a connecting terminal 16 and the heat-transfer pipe 10 side are used as the cathode, hence the copper ion in the plating soln. 9 is deposited on the inner wall surface of the heat-transfer pipe 10, and a rugged copper plated layer is formed. |
