| 摘要 |
The memory is part of an integrated circuit plate or chip, its active side being turned towards and located tightly against a main substratum carrying leads for voltage supply. The voltage is supplied to the chip via contacts in the border section between chip and main substratum. Several chips are used, mutually connected by signal leads. The feed voltage leads are arranged in accordance with the multiple layer technique, overlapping one another, and locating centrally to an active surface on the substratum where the signal leads conduct secret data or where the memory itself is located. (Provisional Basic advised week K25) |
