| 摘要 |
PURPOSE:To perform a sure automatic soldering on the lead of a surface packaging type integrated circuit by pinching the lead material of the integrated circuit with the lead material with a chuck jig and by moving this integrated circuit along the soldering unit by a conveyor. CONSTITUTION:A lead material pressing part 55 is separated from a lead material receiving part 46 by turning a chuck jig 41 and the lead material integrated with an integrated circuit package is inserted into the gap thereof from the opening of the jig main body. The lead material 11 is pinched between the pressing part 55 and receiving part 46 by releasing the forced turning force of a link 49. The chuck jig 41 to which the integrated circuit with the lead material is mounted is mounted to the chain conveyor and transferred along the unit for soldering. With this device, the soldering can effectively be performed on the lead of the surface packaging type integrated circuit.
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