| 摘要 |
PURPOSE:To prevent that the expensive vapor of the inside of a soldering device is leaked out to the external part by providing a main cooling part and sub- cooling part on the carry-in port part and carry-out port part of the part to be soldered in a vapor type soldering device. CONSTITUTION:A vapor phase 25 is formed by evaporating with heating by a heater 24 by inputting a fluorine inert solvent liquid 23 to the lower part of a vapor tank 21 in a vapor soldering device. The body 32 to be soldered is transferred from carry-in port part 31 therein and subjected to a reflow soldering with the latent heat of evaporation owned by the vapor phase 25 and carried out to the external part from the carry-out port part 34. In this device, the main cooling part 34 and sub cooling part 41 to prevent the leakage to the external part of the vapor phase 25 are provided in the inner part of the carry-in port part 31 and carry-out port part 33. In this way the bottom face of the carry-in port part and carry-out port part is cooled to prevent the leakage outside the vapor tank 21 from the carry-in port part 31 and carry-out port part 33 with the re-evaporation of the condensate of the vapor on the bottom face. |
